Εικόνα | KEY Part # / Κατασκευαστής | Περιγραφή / PDF | Ποσότητα / RFQ |
---|---|---|---|
Advanced Thermal Solutions Inc. |
HEATSINK 36.83X57.6X5.84MM FP. |
18628τεμ |
|
Advanced Thermal Solutions Inc. |
HEATSINK 45X45X25MM XCUT T766. |
15560τεμ |
|
CTS Thermal Management Products |
HEATSINK PWR W/PINS BLACK TO-220. |
11002τεμ |
|
Ohmite |
HEATSINK FOR TO-268 BLACK. Heat Sinks HEATSINK FOR TO-268 BLK ANODIZED |
43097τεμ |
|
Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. |
1452τεμ |
|
Assmann WSW Components |
HEATSINK ALUM ANOD. |
71389τεμ |
|
Ohmite |
HEATSINK FOR TO-268. Heat Sinks HEATSINK FOR TO-268 DEGREASED |
46527τεμ |
|
Delta Electronics |
FAN CPU COOLER 90X64MM 12VDC. |
2807τεμ |
|
Advanced Thermal Solutions Inc. |
HEATSINK 35X35X25MM L-TAB T766. |
14589τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
63340 EXTRUSION 1.312X17X3. |
198τεμ |
|
Wakefield-Vette |
HEATSINK FOR PWR MOD/IGBT/RELAY. |
2722τεμ |
|
t-Global Technology |
PH3N NANO 76.2X25.4X0.062MM. |
133600τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
62285 EXTRUSION 1.63X6.75X4. |
587τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
62545 EXTRUSION 2.75X14.75X4. |
247τεμ |
|
Delta Electronics |
HEATSINK ASSY INTEL LGA2011. Heat Sinks INTEL LGA2011 Cooler for INTEL Xeon Sandybridge-E (130W) |
2236τεμ |
|
Advanced Thermal Solutions Inc. |
SUPERGRIP HEATSINK 35X35X7.5MM. Heat Sinks maxiFLOW superGRIP BGA Heatsink, T766, Blue-Anodized, 34.25x34.25x7.5mm |
5401τεμ |
|
Advanced Thermal Solutions Inc. |
SUPERGRIP HEATSINK 31X31X7.5MM. |
5814τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
TO-5 PUSH-ON HEATSINK 6.35MM. Heat Sinks Extruded Collar Style Heatsink for TO-5, Radial Fins, Vertical Mounting, 60 n Thermal Resistance, Black Anodized, 6.35mm |
65859τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
62200 EXTRUSION 0.85X3.5X4. |
976τεμ |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK TO-220 W/SHURLOCK-CLIP. |
3808τεμ |